A. Ciccomancini Scognais currently working as Sr. EMI/RFI Engineer at Huawei. He has 15+ years of experience in the field of SIPI and EMC/EMI. He has worked for Samsung Electronics as Principal Engineer, Apple Silicon Engineering Group (SEG) as SIPI Scientist and Computer Simulation Technology (CST) as EDA Market Development Manager. He co-authored more than 100 papers in IEEE Journal Transactions, International Conferences and relevant EDA magazines. He is senior IEEE member, past chair of TC-10 Signal Integrity committee within the EMC society and he served as an Associate Editor for the Transactions on EMC. He received the DesignCon Best Paper Award in 2009 and 2017, Best Paper Award on IEEE Transaction on Advanced Packaging in 2010 and IMPAS Best Paper Presentation Award in 2010 and 2011. He holds two patents on 5G mmwave technology for mobile applications.