Antonio Ciccomancini Scogna

A. Ciccomancini Scognais currently working as Sr. EMI/RFI Engineer at Huawei. He has 15+ years of experience in the field of SIPI and EMC/EMI. He has worked for Samsung Electronics as Principal Engineer, Apple Silicon Engineering Group (SEG) as SIPI Scientist and Computer Simulation Technology (CST) as EDA Market Development Manager. He co-authored more than 100 papers in IEEE Journal Transactions, International Conferences and relevant EDA magazines. He is senior IEEE member, past chair of TC-10 Signal Integrity committee within the EMC society and he served as an Associate Editor for the Transactions on EMC. He received the DesignCon Best Paper Award in 2009 and 2017, Best Paper Award on IEEE Transaction on Advanced Packaging in 2010 and IMPAS Best Paper Presentation Award in 2010 and 2011. He holds two patents on 5G mmwave technology for mobile applications.


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Far-field Emissions from PCB Cavities

In high-speed circuit designs, power integrity (PI) and electromagnetic interference (EMI) are connected together. When the edge of the cavity created by power (PWR) and ground (GND) planes in PCBs radiates, the peak frequencies in the emissions are the same as the peak frequencies in the cavity self-impedance.

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RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices

Receiver sensitivity and noise coupling to antenna are two major concerns when developing mobile devices such as smart phones and tablets. There are various causes of degradation of receiver sensitivity. However, most of the time they are due to the noise generated by digital signal harmonics on printed circuit board (PCB) patterns, which couple to the antennas. This article presents a methodology to predict noise to antenna coupling and antenna desense.

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