Buyer's Guide

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Ultra Stress-free Polishing AP Tool

ACM Research, Inc., introduced the Ultra stress-free polishing (SFP) ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.


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Power Supply Series: R&S NGP800

The five R&S NGP800 models meet the needs of users seeking minimum device footprint for two or four independent power supplies, with maximum flexibility for voltages up to 250 V, currents up to 80 A and power up to 800 W. Each channel supplies up to 200 W with a maximum of 20 A or 64 V, also covering 48 V automotive and industrial applications.


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