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Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant, half-bridge power driver for GaN high-reliability applications. The technology will be demonstrated at Satellite 2018 March 12-15 in the Teledyne Defense Electronics booth (#619).

Richardson RFPD, Inc. announced today the availability and full design support capabilities for a new insulated metal substrate (IMS) evaluation platform from GaN Systems Inc.

TDK Corporation presents an extremely compact EPCOS film capacitor for the DC link of inverters. With dimensions of just 40 mm x 58 mm (d x l) it offers a rated voltage of 350 V DC and a capacitance of 65 μF.

Rogers Corporation is pleased to introduce RO4460G2, low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials.

Richardson RFPD, Inc. announced today the availability and full design support capabilities for two new series of DC/DC converters from RECOM Power, Inc. (RECOM). 

Saelig Company, Inc. has introduced the Euroquartz QuikXO HC_JF series of switchable crystal oscillators that can provide four different preselected frequencies.

Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance.

UK – Zuken® and XJTAG®, have released a plugin that will enhance Zuken’s CR-8000 with a design for test (DFT) capability improving test coverage by allowing additional design checks during schematic entry. 
 

Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018.  The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.