Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018. The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.
The full lineup of products on display includes: the revolutionary new 7th Generation IGBTs, G1 Series IPMs, Version 6 DIPIPMs (Dual Inline Package Intelligent Power Module), SLIMDIPs (Slim Dual Inline Package), DIPIPM+, J1-Series Automotive modules, X-Series High Voltage IGBTs (Insulated Gate Bipolar Transistor), and SiC (Silicon Carbide) solutions.
In addition, two papers will be presented by the MEUS Application Engineering Team:
Dual High Voltage IGBT Modules with Metal Casting Direct Bonding (MCB) Baseplate
- Presented by Junya Sakai, Eric Motto, and Mike Rogers
- Wednesday, March 7, 2018, 16:35-17:00, Room 213
Exhibitor Seminar: Latest Power Semiconductor Packaging and Chip Technology
- Presented by Eric Motto
- Wednesday, March 7, 2018, 12:00-12:30p, Room 217D
Additional information is available at http://us.mitsubishielectric.com/semiconductors/en/index.html.