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Samtec will participate in the DesignCon 2017 conference and exhibition at the Santa Clara Convention Center, January 31 - February 2. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45-minute technical paper session covering “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.”

Anritsu Co. released a new version of its award-winning SkyBridge Tools™ Test Manager that supports OTDR measurements to establish the industry’s first comprehensive field test automation tool that supports both RF and optical testing. By reducing test time by as much as 90% and increasing accuracy more than 10 times, SkyBridge Tools dramatically simplifies network installation verification, allowing contractors to close out projects more efficiently, receive prompt payment, and start new projects faster.

MathWorks announced new capabilities in HDL Verifier to speed up FPGA-in-the-loop (FIL) verification. The new FIL capabilities enable faster communication with the FPGA board and higher clock frequency simulation. Now, system engineers and researchers can confidently and quickly verify and validate that an FPGA design works as expected in the system, saving development time.

AnDAPT™, announced AmP™ Adaptive Multi-Rail Power Platform family, a new genre of analog power management technology heralding an innovative user paradigm for “On-Demand Power Management,” and taking analog power designs to a new level of flexibility. Users can now, on-demand, select and integrate application targeted, proven Power Components on to an AmP Platform.

CEL introduces the availability of Renesas Electronics Corporation's new series of semiconductor Laser Diodes, the “NX6375AA Series” into North America. The newly developed direct modulation distributed feedback Laser Diodes support 25 Gbps × four wavelengths operation as the light sources in 100 Gbps optical transceivers that are used for communication between servers and routers installed in data centers.

Samtec, a privately held $625 multi million global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications.

TE Connectivity, a world leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.

Spectrum Instrumentation has expanded its line of PXIe-based (PXI Express) high-speed digitizers with nine new cards. The new M4x.22xx series includes modules that offer one, two or four fully synchronous channels. Each channel is equipped with its own analog-to-digital converter (ADC), with real-time signal sampling at rates from 1.25 GS/s to 5 GS/s, and scope-like signal conditioning circuitry that allows programming of parameters such as input gain, signal offset and coupling.

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products.