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The Rubin platform harnesses extreme codesign across hardware and software to deliver up to 10x reduction in inference token cost and 4x reduction in number of GPUs to train MoE models, compared with the NVIDIA Blackwell platform.

Researchers from the University of Glasgow’s James Watt School of Engineering have developed a new method of interfacial imprinting ultra-thin nanowires onto bendable, transparent polymeric substrates.

The power SiC device market is forecast to approach $10 billion by 2030.

According to a brand new "IPoDWDM and Disaggregated WDM" report from Dell’Oro Group, IP-over-DWDM systems demand is expected to grow at an average annual rate of 16%, reaching $4.4 billion by 2030.

NHanced Semiconductors uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Their new Besi bonding system further expands its advanced packaging yield and throughput.

Upgraded compliance test software speeds testing while PHY-Logic debug improves interoperability and end-user satisfaction.

Pico Technology announced the release of PicoScope 7 Software version 7.2.

Indium Corporation announced the global availability of SiPaste C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. 

High-bandwidth, ultra-low-power chip is leveraged for Starlink V3 satellites and future next-generation communication systems.

According to a recently published report by Dell’Oro Group, High End Router equipment revenue grew 23% year-over-year in the third quarter of 2025, with Core Routers staging a strong comeback, growing 68% in that period.