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Hewlett Packard Enterprise and Juniper Networks, Inc. have entered a definitive agreement under which HPE will acquire Juniper in an all-cash transaction.
Samtec, Inc. is shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.
Keysight Technologies and South Korean automotive chipset maker VSI have signed a memorandum of understanding to bring the industry's vision of standardized automotive SerDes to market with unified testing requirements and methods.
IDTechEx's market research report, "AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge," projects that the global AI chips market for edge devices will grow to $22 billion by 2034.
GSI Technology, Inc. has announced that it has been selected by AFWERX for an SBIR Direct-to-Phase II contract in the amount of $1.1 million to demonstrate high-data computation use cases leveraging the distinct compute in-memory architecture of its next-generation Associative Processing Unit-2.
Teledyne e2v HiRelannounces the addition of new space screened versions of its popular 100 V, 90 A and 650 V, 30 A high reliability gallium nitride high electron mobility transistors.
Pico Technology has introduced its Oscilloscope Training and Demo Board, a versatile tool designed to elevate and enhance the user experience with mixed signal oscilloscopes.