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Upgraded compliance test software speeds testing while PHY-Logic debug improves interoperability and end-user satisfaction.

Pico Technology announced the release of PicoScope 7 Software version 7.2.

Indium Corporation announced the global availability of SiPaste C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. 

High-bandwidth, ultra-low-power chip is leveraged for Starlink V3 satellites and future next-generation communication systems.

According to a recently published report by Dell’Oro Group, High End Router equipment revenue grew 23% year-over-year in the third quarter of 2025, with Core Routers staging a strong comeback, growing 68% in that period.

UMC has announced a licensing agreement with imec for the transfer of imec’s iSiPP300 silicon photonics process, featuring CPO compatibility, to accelerate UMC’s silicon photonics roadmap.

Spacechips has introduced its AI1 transponder, a small on-board processor card containing an adaptive compute acceleration platform AI accelerator.

NVIDIA and Synopsys, Inc. announced an expanded, strategic partnership to revolutionize design and engineering across industries.

Power- and battery-conscious designs can operate longer under typical conditions through more accurate and energy-efficient power monitoring.

Ultra-fast, high-density IVR sets new standard for AI and HPC power delivery with minimal voltage droop and maximum scalability.