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TE Connectivity (TE) has introduced zSFP+ stacked belly-to-belly connectors that are designed to support data rates at both 28G NRZ and 56 Gbps PAM-4.

PPI 2010 case size broadband resistors are specifically designed to operate at frequencies up to 50 GHz.  With microwave laser-trimming used to ensure a tight tolerance at high frequencies, these resistors are wire bondable, solderable, and can be used in a flip-chip configuration.

Würth Elektronik is expanding its extensive range of signal transformers. The new series of WE-STST super tiny signal transformers for LAN interfaces features a maximum component height of 2.9 mm and can be used up to 1000Base-T applications with at least 350 µH inductance.

VadaTech announces the VTX660. The VTX660 is an 8U VPX hassis with six 3U VPX slots. The chassis can accept 0.8-inch, 0.85-inch and 1.0-inch pitch modules and is ideal for development and deployment.

Supplyframe’s subsidiary company SamacSys, has completed an integration with Cadence Design Systems, Inc.’s Allegro® and OrCAD® PCB design tool suites.

Samtec Inc. and REFLEX CES announced a embedded optical development platform at SC19. This new solutions combines the latest FPGA solutions from REFLEX CES with the FireFly™ Micro Flyover System™ from Samtec.

Vishay Intertechnology, Inc. introduced a series of automotive Grade AC and pulse metallized polypropylene film capacitors for hybrid and electric vehicles.

Cree, Inc. and STMicroelectronics announced the expansion and extension of an existing multi-year, long-term silicon carbide wafer supply agreement to more than $500 million.

Keysight Technologies, Inc., FormFactor, Inc., and CompoundTek have joined forces to accelerate integrated photonics innovations.

Smiths Interconnect announces that it has completed the acquisition of Reflex Photonics, Inc. (“Reflex”) to expand in the high-speed data-transmission market.