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Keysight Technologies, Inc., has launched the Innovate Anywhere program in response to COVID-19,  spanning three key areas: 90-day software trials, remote learning, and scalable live network testing.

Rohde & Schwarz has added time saving functions to its high end R&S ESW EMI test receiver. It has integrated the fast time domain scan as standard in its R&S ESW EMI test receiver.

Vishay Intertechnology, Inc., expanded its IHLE^® series of low profile, high current inductors featuring integrated e-shields for the reduction of EMI with commercial and Automotive Grade devices in the 5050 case size.

 Laird Performance Materials has responded to these challenges by developing Softzorb MCS. This soft, conformable absorber eliminates unwanted signal noise while also acting as a gap filler that reduces coupling—all without damaging sensitive components.

Glen Clark, Cadence Design Systems corporate VP of R&D for custom ICs and PCBs, discusses the acquisition of AWR and the vision for integrating the two companies’ capabilities to improve the design of RF, microwave and mmWave systems.

The R&S IQW100 brings signals from the real world into the laboratory to simulate real world test environments, used in combination with selected midrange R&S signal analyzers and generators.

TE Connectivity (TE), announced the launch of its STRADA Whisper cable receptacles, which allow engineers to start designing for up to 112G PAM-4 data rates in servers, switches, and routers.

Pixus Technologies, now offers a various OpenVPX backplanes utilizing the ultra-rugged KVPX style connector.   This type of connector is often used in the harshest Aerospace applications.

Cadence Design Systems, Inc., announced that the release of the Cadence® digital full flow, with hundreds of completed advanced-node tape outs, has been enhanced to further optimize power, performance and area (PPA) results across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI).

ACM Research, Inc., introduced the Ultra stress-free polishing (SFP) ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.