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Samtec announces the release of a new low-profile PCI Express^® edge card connector featuring Edge Rate® contacts for optimized signal integrity. The connector is PCI Express^® Gen 4 compliant and supports one, four, eight and sixteen links for different bandwith requirements.

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM8065, a µModule^® (power module) step-down regulator with up to 40V input voltage (42V abs max), which can safely operate from unregulated or fluctuating 12V to 36V input supplies in noisy environments such as industrial robotics, test and measurement, medical, factory automation and avionics systems.

The AXIe Consortium announced a new specification, Optical Data Interface, suitable for high-speed instrumentation systems addressing challenging applications in 5G communications, mil/aero, and advanced communication research. The AXIe Consortium was joined by Conduant Corporation, Guzik Technical Enterprises, Intel Corporation, Keysight Technologies, Samtec Incorporated, and Xilinx in endorsing the standard and stating their plans to offer components or instrumentation products compliant with the new standard.

Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems.

The German Fraunhofer Heinrich Hertz Institute HHI and Silicon Valley Missing Link Electronics (MLE) collaborate to optimize 25G/50G Ethernet Low-Latency Media Access Controller (MAC) for Xilinx Ultrascale+ Transceiver Technology.

EDI CON China 2018, the conference that brings together engineers working on high-frequency analog and high-speed digital designs and takes place March 20-22, 2018 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open.

Keysight will host a complementary seminar on crosstalk and jitter challenges, from simulation to test. Keysight technical experts MinJie Chong and Hee-Soo Lee will discuss and demonstrate the latest tools and techniques for solving these challenges. Lunch is provided.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the CoolSiC™ Schottky diode 650 V G6. This latest development in the CoolSiC diode family is built upon the distinctive characteristics of the G5, providing reliability, quality, and increased efficiency. The CoolSiC G6 diodes are a perfect complement to the 600 V and 650 V CoolMOS™ 7 families.

Pickering Electronics, a long-established Reed Relay manufacturer, will showcase the world’s highest density Reed Relay at productronica 2017, on booth A1.452.

TE Connectivity (TE), a world leader in connectivity and sensors, today announced that its microQSFP pluggable connectors, cages and cable assemblies are gaining rapid traction in the industry as indicated by cloud server application design wins and significant ongoing data center switches, and wireless networking equipment design efforts.