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The EMV in Stuttgart once again proved itself to be a significant platform for the field of electromagnetic compatibility. The event, which took place from 19 – 21 March 2019, showcased a broad spectrum of product and services at the exhibition, and presented current expert knowledge in the workshops.
Infineon Technologies AG extends its portfolio of high current system chipset solutions with the first 16-phase digital PWM multiphase controller, enabling currents of 500 to 1000 A for next generation CPUs, GPUs, FPGA and ASICs used in artificial intelligence (AI) servers and 5G datacom applications.
Infineon Technologies AG introduces the newest member of its integrated point-of-load product family, the IR38164 DC-DC POL converter. Infineon's IR38x6x family offers either full SVID compatibility or 3-bit PVID flexibility.
Silicon Labs has introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed to provide accurate current and voltage measurement with very low drift across temperature.
TE Connectivity (TE) is introducing a new series of Ethernet jacks with integrated magnetics and Power over Ethernet (PoE) specifically designed for industrial applications which help to simplify PCB design efforts and simplify peripheral powering in the total system.
EDI CON China 2019 taking place April 1-3, 2019 at the China National Convention Center in Beijing has announced the finalists in the second annual EDI CON China Product Innovation Awards.
At EMV in Stuttgart, Rohde & Schwarz will demonstrate highlights such as the new R&S ELEKTRA EMC test software for automated certification and precompliance tests and R&S AdVISE for automated visual checks. Brand new are the test solutions for spurious emission measurements for 5G components.
Dialog Semiconductor plc, announced the SmartBond DA1469x family of Bluetooth low energy SoCs, its advanced range of multi-core microcontroller units (MCUs) for wireless connectivity.
Keysight Technologies, Inc. announced it is exhibiting the company's newest optical and high-speed digital test solutions at OFC 2019, booth 2600, San Diego Convention Center, March 5th – 7th, 2019.