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TE Connectivity, a world leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.

Spectrum Instrumentation has expanded its line of PXIe-based (PXI Express) high-speed digitizers with nine new cards. The new M4x.22xx series includes modules that offer one, two or four fully synchronous channels. Each channel is equipped with its own analog-to-digital converter (ADC), with real-time signal sampling at rates from 1.25 GS/s to 5 GS/s, and scope-like signal conditioning circuitry that allows programming of parameters such as input gain, signal offset and coupling.

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 

ProPlus Design Solutions Inc.  unveiled 9812DX™ wafer-level 1/f noise characterization system, an enhanced version of its de facto standard 9812D™, setting records for measurement speed, system resolution and coverage of different types of measurement requirements.

TRAK Microwave, a microwave brand of Smiths Interconnect, has announced the addition of the Stratum 1 Network Time Server to its wide range of product offerings. The 8461 NTP Server from TRAK Microwave helps provide a critical time synchronization bridge to Isolated Network Domains via an optical IRIG-B DC-level shift or Wireline Modulated IRIG-B link with an on-board OCXO holdover oscillator, for ultra-reliable timing.

Samtec, a privately held $625M global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of an extended temperature version of its FireFly™ Active Optical Micro Flyover Cable Assembly. The new ETUO series support temperature ranges of -40° to +85°C.

Targeting wireless infrastructure and other communications equipment, Integrated Device Technology (IDT) introduced four dual-channel fanout buffers for distributing high frequency clock and data signals. The 1.8 V LVDS buffers add very low phase jitter, typically less than 45 fs.

Leti, an institute of CEA Tech, announced the launch of a European Commission Horizon 2020 project to enable mass commercialization of Si-photonics-based transceivers to meet future data-transmission requirements in data centers and super computing systems.

MACOM has entered into a definitive agreement to acquire AppliedMicro Circuits Corp. The acquisition, valued at approximately $770 million, allows MACOM to strengthen its portfolio for the data center market, adding OTN framers, MACsec Ethernet networking components and a single-lambda PAM4 platform.