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EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES. Rabbeni will bring his significant insights on semiconductor technology to bear on his talk entitled, “Technologies for the Next Wave of Mobile Data.”

Teledyne LeCroy, a worldwide leader in serial data test solutions, will showcase the world’s first Serial Attached SCSI 4.0 (SAS) live technology demonstration at DesignCon 2017. The next evolution of the enterprise storage standard, SAS 4.0 doubles the effective bandwidth over the current 12Gb/s SAS specification yet preserves backward compatibility to enable easier data center adoption. The Teledyne LeCroy exhibit will feature the Sierra T244 Protocol Analyzer platform, the first commercially available solution for testing and validating SAS 4.0 protocol.

Pickering Interfaces, a leading provider of modular signal switching and simulation for electronic test and verification, has expanded their range of High-Density 2 Amp PXI Multiplexers.

DesignCon previews announcements from more than 50 exhibitors participating at the event next week. DesignCon, the premier educational conference and technology exhibition for electronic design engineers in the high-speed communications and semiconductor communities, will present three days of deeply technical sessions, special events and a robust expo hall hosting the industry's leading solution providers. Via the expo hall, attendees will have the opportunity to experience emerging solutions first hand and connect with leading companies on what's to come.

Rohde & Schwarz has introduced the R&S RT-ZPR20, extremely low-noise power rail probe with a bandwidth of 2 GHz

Tektronix, a leading worldwide provider of measurement solutions, today introduced new equivalent time automated compliance test solutions for 4-lane 100G electrical interfaces defined in the IEEE 802.3bm and 802.3bj specifications. The new capabilities along with the full set of Tektronix solutions for 100G and 400G characterization and validation will be demonstrated February 1-2 at DesignCon 2017, Booth 741.

Anritsu Co., a DesignCon 2017 Diamond Sponsor, will present testing solutions and technical sessions to aid engineers more efficiently develop next-generation chips, boards and systems used in emerging applications, including IoT/M2M and 5G, at DesignCon, beginning January 31 in Santa Clara, CA. Signal integrity solutions featuring the award-winning Signal Quality Analyzer (SQA) MP1800A BERT, as well as the VectorStar® and ShockLine™ vector network analyzers (VNAs) will be on display in the Anritsu booth (#633) throughout the show.