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Artech House today announced the publication of Intersystem EMC Analysis, Interference, and Solutions by recognized expert Uri Vered. This comprehensive new resource provides methods and tools for defining EMC requirements and techniques for performing predictions and calculations to achieve electromagnetic compatibility.

Imec, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.  This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems.

Microsemi Corporation, today announced its extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules.

Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. The compact converters, which offer one of the lowest EMI performance for low-voltage point-of-load applications, which are ideal for automotive infotainment and ADAS applications.

Keysight Technologies, Inc., today announced that Ixia, a Keysight Business, is first to ship a 400GE test system with multi-rate 200/100/50GE speed options for the K400 400GE QSFP-DD load module family. These multi-rate speed options allow network equipment manufacturers (NEMs) to test products at speeds based on the new IEEE 802.3cd draft standard and IEEE 802.3bs standard using the 400GE QSFP-DD module at 200GE, 100GE, and 50GE speeds, from a single port.

Richardson RFPD today announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.

Silicon Labs and Calnex Solutions today announced a proven reference design for ITU-T G.8262-compliant Synchronous Ethernet (SyncE) applications at 25G and 100G Ethernet rates. The solution is based on the Marvell^® Alaska^® C family of high-speed Ethernet transceivers, Silicon Labs’ Si5348 low-jitter network synchronizer clock and the Calnex Paragon-100G test platform.

Hirose, the designer and manufacturer of connector solutions, has designed an intrafacility fiber cable (IFC) assembly system that supports bidirection optical transmission of 6.25Gbps and unidirection up to 12.5Gbps (6.25Gbps x 2ch). The high-speed BF4-IFC Series cable assembly integrates the BF4M Series active optical connector into a rugged circular shell with a superior push-pull design for quick and easy mating/unmating operation.