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Viavi Solutions Inc., introduced test and measurement offerings for optical lab, production and manufacturing environments, enhancing the industry’s most complete line of photonic test modules.

Jabil Inc., announced that its Photonics business unit, a leading provider of customized end-to-end design, manufacturing, and test solutions for optical communications products, successfully completed live network trials for the application of 100G in unamplified metro regional link scenarios.

Today’s vehicles support a multitude of wireless standards requiring high-performance antennas, such as satellite navigation (GNSS), tire pressure monitoring systems (TPMS), keyless entry (e.g. UWB) and cellular connectivity (4G, 5G). The challenge for tier one component suppliers and OEM vehicle designers is to ensure optimal performance of individual antenna modules and entire vehicles after the systems have been integrated.

To help accelerate the upgrade of network environments and improve performance for the enterprise and gaming communities, Realtek Semiconductor, the market leader in integrated circuits (IC) for the past 30 years, has launched the second generation of its 2.5GbE chip.

Keysight Technologies, Inc. announced the first 256 GSa/s arbitrary waveform generator (AWG), Keysight's M8199A, with 65 GHz analog bandwidth in a compact two-slot AXIe module.

Viavi Solutions Inc., introduced the first 16-lane protocol analysis system for PCI Express^® 5.0, operating at 32Gbps per lane. The VIAVI Xgig 5P16 Protocol Analyzer delivers detailed traffic analysis and jamming capabilities, enabling test and validation to meet the most demanding performance needs of emerging compute-intensive applications such as 400 Gigabit Ethernet, artificial intelligence (AI), IoT, and hyperscale computing.

TE Connectivity (TE), has introduced its high-power pin and socket product portfolio, addressing high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

AltiumLive, Altium’s annual flagship printed circuit board (PCB) design conference, is transitioning from a live, three-day event into a virtual summit. The free event is open to all and meticulously curated to preserve the quality and content the electronic design community has come to expect.

GLOBALFOUNDRIES® (GF), announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. Developed in collaboration with Mentor, a Siemens business, the ML-enhanced DFM solution, built on Mentor’s Calibre® nmDRC platform, can provide customers with a more effective design and development experience and, ultimately, contribute to a faster time to market.

GLOBALFOUNDRIES® (GF), announced at its Global Technology Conference the next generation of its FDX^TM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices.