Industry News

EDI CON USA Scholarship

EDI CON USA 2017 Launches Scholarship Program

Open to any student interested in high frequency or high-speed electronics

EDI CON USA 2017 announces a new scholarship program for university students, where any student that attends can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of major sponsors on September 12-13.


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Analog Devices Signs On as Host Sponsor of EDI CON USA 2017

ADI takes the lead sponsorship position at EDI CON USA, supporting networking and training opportunities for engineers working in high-frequency and high-speed applications.

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that Analog Devices, Inc. (ADI) is taking on the role of host sponsor of the exhibition and conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.


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EDI CON USA

High Speed Digital Symposium Launches at EDI CON USA 2017

Day two of the three-day conference includes an afternoon symposium on material characterization challenges in high-speed digital design led by session chair Eric Bogatin.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA announced the addition of a the High-Speed Digital Symposium to its conference line up during the event at the Hynes Convention Center, September 11-13 in Boston, Mass.

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