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TE Connectivity (TE) will educate and inspire system designers at DesignCon 2022 by demonstrating an array of solutions for compute and networking systems.

Isola Group will be exhibiting at the upcoming DesignCon 2022 expo and conference. 

CAES introduced a line of RadHard NOR Flash Memory devices that deliver the boot-memory densities required by microprocessors and FPGAs used in space applications.

VIAVI Solutions Inc. (VIAVI) announced that the PCI-SIG® has completed their correlation process and approved the results generated by the VIAVI Xgig PCI Express® (PCIe®) 5.0 Exerciser to test link and transaction protocol compliance at 32GT/s.

At DesignCon 2022, Rohde & Schwarz will show live demos covering industry trends in cooperation with industry experts such as Samtec, Ataitec, Clear Signal Solutions, and more.

DuPont Microcircuit and Components Materials (MCM) business announced the launch of 5881, a Silver/Silver Chloride (Ag/AgCl) conductive ink/paste for healthcare applications.  

Rohde & Schwarz announced one of the most flexible ultrawide band broadband RF amplifiers available on the market. The R&S BBA300 family provides a single amplifier solution that eliminates the need to switch instruments or bands during a test.

SiTime® Corporation introduced the Elite X™ Super-TCXO® for edge networks such as data centers, 5G front haul, connected cars, and industrial IoT. In these applications, Elite X solves critical timing problems and enables delivery of services. 

Teledyne e2v semiconductors’ ultra-high density DDR4 memories continues, now that flight models are being shipped to key customers around the world and is now moving into the mass production phase, with the space-grade radiation tolerant DDR4s being available.
 

MathWorks introduced Release 2022a of the MATLAB and Simulink product families.