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Successful validation of a 0.5-megawatt system for the U.S. Navy’s 10 MW Advanced Circuit Breaker Development Program demonstrates Menlo Micro’s scalable power-switching platform addressing aerospace & defense, data center, and industrial markets.
At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber sealant, a material system designed to deliver low thermal impedance while significantly reducing mechanical stress on chips.
The Rubin platform harnesses extreme codesign across hardware and software to deliver up to 10x reduction in inference token cost and 4x reduction in number of GPUs to train MoE models, compared with the NVIDIA Blackwell platform.
Researchers from the University of Glasgow’s James Watt School of Engineering have developed a new method of interfacial imprinting ultra-thin nanowires onto bendable, transparent polymeric substrates.
According to a brand new "IPoDWDM and Disaggregated WDM" report from Dell’Oro Group, IP-over-DWDM systems demand is expected to grow at an average annual rate of 16%, reaching $4.4 billion by 2030.
NHanced Semiconductors uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Their new Besi bonding system further expands its advanced packaging yield and throughput.
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