Industry News

RSS

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

Traditional space LDOs rely on silicon MOSFETs that suffer from radiation degradation. To solve this, Tony Marini from EPC Space highlights a revolutionary alternative using enhancement-mode Gallium Nitride (eGaN) HEMTs. Their unique material physics inherently resists Total Ionizing Dose (TID) effects without performance loss, ensuring exceptional parameter stability in harsh orbital environments.

The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.

According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.

Molex, a global electronics leader and connectivity innovator, introduced VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks.

Signal Integrity Journal is pleased to welcome Benoit Derat as its newest Technical Advisor.

HYPERLABS has expanded its 0.8 mm, 145 GHz component series with the introduction of the HL8818 Broadband 50Ω Termination.

Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high performance optical and copper interconnect solutions in booth #2004 at the upcoming ECOC exhibition.

Samtec, Inc. announces the release of its 1.0 mm vertical compression mount board connector, the 100-CM Series.