Signal Integrity

RSS

VNAs make measurements in the frequency domain and can be used to supplant the information that native time domain instruments, like fast oscilloscopes, Signal Quality Analyzers (BERTs) and Time Domain Reflectometers/Transmission instruments (TDR/TDT’s) already provide.

This paper assesses how modern tools can be used to address poweraware SI challenges associated with I/O modeling, interconnect modeling, simulation, and analysis.  

This technical paper provides correlation studies between measured data and multiple field solver technologies, providing multiple references to different types of analyses that include AC frequency domain comparisons for both power integrity and signal integrity. It includes time domain characterization of the results using TDR and noise measurements for both packages and printed circuit boards. 

One of the most critical design parameters for PCB manufacturers and designers is the impedance of PCB routing. Failure to meet certain impedance design parameters can make the product on the printed circuit board not meet design specifications. This application note will introduce the capabilities for SIwave to automatically, and quickly, scan the entire PCB or package layout and determine the anticipated impedance using the design stackup to define the dielectric materials and layer thickness.

Crosstalk, or coupling, in high speed printed circuit board and packages represent one of main signal integrity design challenges. The cost of failure is very high and requires careful design strategies. This application note will introduce the capabilities for SIwave to automatically, and quickly, scan the entire PCB or package layout and report Near and Far End crosstalk coefficients.

In order to accurately compute the response from high speed packages and printed circuit boards, it is essential that they are modeled comprehensively in simulation tools. This application note will introduce the capabilities for SIwave to model conformal solder mask layers in the stackup.

SIPro uses an innovative new composite EM-technology that delivers high-frequency accuracy, together with the speed and capacity required for densely-routed cutting-edge PCB design. The PIPro solution is a collection of three PI-specific simulation engines for DC IR drop, AC power delivery network (PDN) impedance, and power plane resonances analysis.

This paper will present correlation data to validate the software and hardware tools necessary for fast-track deployment in upcoming PAM-4 applications.

In this paper we report results of IBIS-AMI based link analyses of realistic 56G PAM4 channels. Systems under investigation are represented by channel S-parameters and SerDes AMI models that capture actual chip designs, including impedance, equalizations and embedded tuning.

A quick overview of how to download and use Signal Integrity Design Using Keysight Advanced Design System (ADS) including examples.