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Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI related topics, Annual 2021 issue is getting rave reviews. If you haven’t downloaded the digital version yet, there is still time!

High-speed serial interfaces often transmit data with differential signaling. A trace differential probe is used and often provide an additional connection for ground – especially the higher bandwidth models. The ground connection on the R&S®RT-ZMxx modular multimode probes can be used to improve measurements on high-speed differential interfaces.

A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important.

EMI test sites for radiated emission measurements in the 1 GHz to 18 GHz frequency range rely on free space conditions to minimize the influence of reflections on the received signal. Practically, this is achieved using shielded enclosures that are fully lined with RF absorbing material (fully anechoic room, FAR).

With continuously increasing data rates, signal integrity aspects of high-speed digital designs and the components used become more and more challenging.