Articles Tagged with ''DesignCon''

Learn about many of the new products introduced and demonstrated at DesignCon 2024. 

Foxconn Interconnect Technology showcased the demonstration of its 224 Gbps signal transmission through their OSFP 2x1 SMT connector Upper Port with a 1M Passive DAC at the DesignCon 2024 exhibition.

Teledyne LeCroy has announced the extension of their patented CrossSync PHY technology to support the PCI Express 6.0 specification.

Teledyne LeCroy and Alphawave Semi unveil PCI Express 7.0 signal generation, transmission, and measurement at DesignCon, showcasing the culmination of their collaborative efforts with results that push the boundaries of signal transmission and measurement technologies.

The new QCA platform will play a critical role in scaling interconnect technologies to high-volume manufacturing for AI, HPC, and Cloud applications.

Junkosha has chosen DesignCon 2024 as the platform to showcase its breakthrough ultra-phase stable advancements in high frequency cabling solutions.

TE is addressing 224G and PCIe Gen 6 signal integrity challenges for the next generation of AI systems, continuing to extend the value of copper, with a combination of passive and active copper cabling solutions.

Keysight Technologies, Inc. introduces Chiplet PHY Designer, the latest member in its family of high speed digital design and simulation tools that provides die-to-die interconnect simulation, which is a key step in verifying performance for heterogeneous and 3D integrated circuit designs commonly referred to as chiplets.

Rogers Corporation will exhibit at DesignCon in Santa Clara, Calif. highlighting some of its high performance circuit materials.

DesignCon panel co-chairs extend an invitation to a special tech panel on generative AI and large language models for electronic designs.