April 25, 2017

Sponsored by: Rohde & Schwarz

Rohde and Schwarz

Editors Choice

Pop Quiz: When is an Interconnect Not a Transmission Line?

By Eric Bogatin

Many of my students, and many engineers, have been brainwashed into thinking that an interconnect only behaves like a transmission line at high frequency and at low frequency it looks like a capacitor. But is this true?



Sierra Circuits

Understanding Signal Integrity for PCB Layout
By Sierra Circuits

This white paper addresses the integration of signal and power integrity analysis, 3D-electromagnetic solving, and fast DRC checking in a single unified environment.


When Worlds Collide: Why RF Design is Very Different from High-Speed Digital Design
By Eric Bogatin

You would think that interconnect design for rf applications and high-speed digital applications would be very similar. After all, the upper frequency range of the applications are similar. Read on to find out more.

Best Practices for Connector Models
By Eric Bogatin

At the 2016 IEEE EMC Symposium in Ottawa, I had the opportunity to talk with two of the worlds’ experts on high frequency electrical characterization of interconnects and gained new insight on best practices for connector modeling and measuring. Here’s what they had to say.


Cadence Design Systems Inc

Designing Complex, High-Speed Boards with Fewer Re-Spins
By Cadence Design Systems Inc.




How Interconnects Work: Modeling Conductor Loss and Dispersion
By Yuriy Shlepnev

Let’s face it, interconnects are the major bottleneck in communication between electronic components. Here’s how to overcome some of the obstacles.

Ensuring High Signal Quality in PCIe Gen3 Channels
Anil Kumar Pandey

Understand PCIeGen3 and how to ensure the best outcomes in signal integrity analysis and compliance testing.




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