Leading developer and supplier of advanced circuit materials Isola Group will be welcoming visitors to Booth #733 at the DesignCon 2024 Expo scheduled for January 31 to February 1, 2024. Set for one of California’s leading event centers, the Santa Clara Convention Center (Santa Clara, Calif.), DesignCon 2024 is known as the place “where the chip meets the board.” The event also features a high-level technical conference from January 30 to February 1 for designers of high-speed and high frequency printed-circuit boards (PCBs). Isola will be featuring its new halogen-free IS580G circuit materials, with representatives at the exhibition booth offering advice and guidance on achieving cost-effective, high-performance PCBs for aerospace, 5G, and automotive electronics in need of a halogen-free foundation.

Isola’s new IS580G halogen-free laminates and prepreg materials are well suited for high-speed-digital circuits, RF/microwave and millimeter-wave circuits, and high-speed optical and photonics circuits. They are high-density-interconnect technology compatible for closely spaced circuits and FR-4 process compatible for ease of manufacturing. The circuit materials are available in standard material thicknesses ranging from 2 to 30 mils and 0.5, 1.0, and 2.0 oz. copper weights. They exhibit dielectric constant (Dk) or permittivity of 3.8 at 5, 10, and 20 GHz, and loss tangent or dissipation factor (Df) of 0.006 at 5, 10, and 20 GHz.

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Halogen-free IS580G circuit materials are less toxic and have a lower environmental impact than halogenated flame retardants. Halogen-free materials also have improved electrical and thermal performance compared to equivalent halogenated materials. They are fabricated with conductive-anodic-filament (CAF) resistant materials to minimize formation of CAF structures and failures in PCBs, and offer outstanding thermal properties with a minimum glass transition temperature (Tg) of 190°C. IS580G is stable with temperature, with Z-axis CTE of 30 ppm/°C below Tg and 190 ppm/°C above Tg for an overall expansion of 1.8% from 50 to 260°C.