February 9, 2017
Signal Integrity Journal editors review all of the new products and technologies on display at DesignCon 2017 while hanging out with Chiphead.
At EDI CON USA 2017 (Hynes Convention Center, Boston, MA September 11-13), there will be a special High-Speed Symposium detailing the best practices used in the industry for integrating material properties into high-speed channel simulations.
Running into old friends at DesignCon 2017 – some highlights from my return to Santa Clara and future speaking opportunities in the industry.
This webinar will explore the EM simulation of shields at both the electronics and vehicular level, while demonstrating how special modeling techniques applied in the 3D TLM method can be used to improve the efficiency of capturing the important coupling mechanisms.
Signal Integrity Journal shot 10 video demos in the exhibition from leading companies in the industry. Find out about the latest products featured at the event.