Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its 2022 issue. The magazine is available in print (by subscription and at select SI/PI/EMI events) and is also available as a technical eBook.
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- "The Reports of Copper’s Death May Be Exaggerated,” Eric Bogatin
- “224 Gbps Link Systems: Modulation vs. Channel vs. FEC,” Mike Li, Hsinho Wu, Masashi Shimanouchi et al
- “High Bandwidth Connectors: Sorting Out What Matters,” Janine Love
- “Measuring High Output Voltage Regulator Noise,” Masashi Nogawa and Steve Sandler
- “Beware of the Skew Budget: How Fiber Weave Effect Can Affect Your High-Speed Design,” Bert Simonovich
- “What to Expect in a Multi-Drop Bus,” Saish Sawant and Tim Wang-Lee
- “Welcome Home: DesignCon Returns to Santa Clara, Calif., in April,” Suzanne Deffree