As electronics get smaller and faster, thermal issues are becoming increasingly challenging. Problems can appear in chips, boards, packages, and entire systems. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence® Celsius™ Thermal Solver enables designers to develop strategies to mitigate these impacts.

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By downloading this white paper, your contact information will be shared with the sponsoring company, Cadence, and you may be contacted by them directly via email or phone for marketing or advertising purposes.