This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence® Celsius™ Thermal Solver helps designers analyze the impact and develop strategies to mitigate this impact, particularly for 3D-ICs.

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By downloading this white paper, your contact information will be shared with the sponsoring company, Cadence, and you may be contacted by them directly via email or phone for marketing or advertising purposes.