Cinch Connectivity Solutions, a Bel group company, announces the commercial availability of its CIN::APSE® stacking connector series.

CIN::APSE® solderless, high density, stacking interconnects are used for board to board, flex to board and component to board applications. CIN::APSE® stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. The CIN::APSE® 1.0 mm pitch accommodates high density circuits between boards. The CIN::APSE® mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection. CIN::APSE® is one the most widely implemented solderless, high speed interconnects in the industry. With a flight proven history, CIN::APSE® stacking connectors are found on military, aerospace and satellite applications worldwide.

For more information on the CIN::APSE stacking connector offering, please visit our website at or download the CIN::APSE catalog. CIN::APSE stacking connectors are also available through our distributors, Digi-Key, Mouser and Newark.