Low-speed printed circuit board (PCB) designs now have to deal with high-speed switching problems. This article examines the ground bounce generated from an LCD assembly while evaluating the impact of the ground bounce on the system level EMI. Three solution strategies to mitigate the ground bounce are analyzed, the pros and cons of each strategy are provided along with the test results.
If you are working on chip and package design, ground bounce is an important concern. SIJ Technical Editor Eric Bogatin and his University of Colorado students share the results of a study in best design practices to minimize ground bounce noise.