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EDI CON Conversations Offer New Insights

The third Electronic Design Innovation Conference (EDICON), was held Oct 17-18, 2018 in Santa Clara. The attendees were treated to two days of technical talks, tutorials and tradeshow with the overlapping topics of RF, SI, PI and EMI. This is a unique combination, allowing cross fertilization between these otherwise separate fields.


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EDI CON China 2016 takes the Gold

Fourth year sets records for attendance and exhibitors

EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.


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