Items Tagged with 'DesignCon 2026'

Junkosha have announced the launch of their latest Microwave/mmWave Coaxial Cable Assemblies at this year’s DesignCon, engineered to support ultra high-speed signal transmission up 110 GHz and 120 GHz with skew matched to 0.5 psec.

Anritsu, in collaboration with Tektronix, Teledyne LeCroy, and SiPhx, will conduct live demonstrations, including two on PCI-Express^® 6.0 and PCI-Express^® 7.0. Other demonstrations in the Anritsu booth will include 448G interconnect development and broadband S-parameter characterization.  

Molex has set an industry benchmark for test and measurement with the introduction of Molex Cardinal Multi-Port High Frequency Coaxial Assemblies.

Building on the proven on-substrate and near-ASIC expertise of Molex, Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4 and beyond.

Samtec announces that it will showcase high-performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026.

Rohde & Schwarz will exhibit its latest advancements in test and measurement technology at DesignCon 2026, booth #949. Attendees can participate in a full-day technical workshop open to all DesignCon visitors, experience hands-on demonstrations of cutting-edge solutions, and enter a drawing to win the new MXO 3 oscilloscope.