Samtec High-Density Arrays are designed to maximize density, bandwidth, and routing flexibility. Popular SEARAY™ interconnects are available with up to 500 I/Os or 125 differential pairs. The rugged Edge Rate® contact system is less prone to damage when zippered during unmating. The SEARAY .8mm system is 2x the density of standard SEARAY.
High-speed board-to-board systems are rated at 28+ Gbps and come in a variety of design options, including low profile Q-Strip® interconnect systems with an integral ground/power plane, available in 0.50, 0.635, and 0.80 mm pitch. Q2™ is a rugged system with increased insertion depth for rugged applications. Edge Rate® strips incorporate rugged Edge Rate Contacts which are less prone to damage when zippered during unmating. 
High-speed cable assemblies are available with 50 Ω ribbonized coax cable, or differential 100 Ω twinax cable. Assemblies include high-density arrays, systems with integral ground planes, hermaphroditic, rugged Edge Rate®, high-speed PCI Express® systems, and future-proof assemblies to design-in copper with the ability to upgrade to optical with the same PCB interconnects. 
The FireFly™ Micro Flyover System™ gives designers the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system. The Industry-leading miniature footprint allows for higher density close to data source. The data “flies” over lossy PCB for up to 28 Gbps per lane. 
The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance. Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.
Samtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.
Samtec’s flyover QSFP28 cable assembly (FQSFP Series) achieves 28 Gbps performance and is backward compatible with all QSFP assemblies. This direct attach system, with press-fit tails that provide low speed signals and power to the PCB, allows drivers to be remotely located for design flexibility and greater control over thermal cooling.
ExaMAX® high-speed backplane system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch with a roadmap to 56 Gbps. This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability.
Samtec’s 0.635 mm pitch, high-speed, multi-row strip - packages the same reliable contact system and ease of processing found in the SEARAY™ family in an even smaller and higher-density strip design.
Samtec’s x4 duplex 28 Gbps FireFly™ optical engine (ECUO Series) brings its industry-leading density to the 100 Gbps Datacom/Telecom and HPC markets. Designed with thermal optimization in mind, options are available for both forced air and cold plate cooling scenarios. 
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Company Profile
Founded in 1976, Samtec is a privately held, $662 million global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board and IC Packaging, High Speed Board-to-Board, High Speed Cables, Mid-Board and Panel Optics, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit https://www.samtec.com
Location:
Samtec Inc.
New Albany IN 47151-1147
United States
