Traditional communication and switch architecture leverages integrated designs in a single high-speed PCB, but this architecture is beginning to face signal integrity and thermal challenges at 56 and 112 Gbps PAM4.  Samtec Flyover™ QSFP-DD solutions offer improved signal integrity and enable new modular system architectures, which improve thermal efficiencies and lower costs. These next generation modular system architectures also enable greater design flexibility.

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