Eric Bogatin, Signal Integrity Journal Technical Editor
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Eric Bogatin is Technical Editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado - Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all of the information available and finding the best quality content to publish on signalintegrityjournal.com.

EDI CON Conversations Offer New Insights

The third Electronic Design Innovation Conference (EDICON), was held Oct 17-18, 2018 in Santa Clara. The attendees were treated to two days of technical talks, tutorials and tradeshow with the overlapping topics of RF, SI, PI and EMI. This is a unique combination, allowing cross fertilization between these otherwise separate fields.


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Life at the Low End

We usually associate problems with the power distribution network (PDN) as from excess VRM noise, or from transient current draw from the core or I/O drivers. But that’s not the only source of PDN noise. Some failures can arise from dull, boring, mundane problems at DC.


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A Design Rule Check List

No matter how well you understand the design principles, and no matter how much experience you have in designing boards, it’s easy for some problems to slip through the cracks because you just forgot to check that feature, or your design is just too big to manually check. This is where a design rule checker comes in.


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Two New Open Source Tools for De-embedding

At DesignCon 2018, the IEEE P370 standards group announced the release of two important tools to assist all engineers for de-embedding. In the presentation by Jason Ellison and Heidi Barnes, “A NIST Traceable PCB Kit for Evaluating the Accuracy of De-Embedding Algorithms and Corresponding Metrics”, the two new tools were announced, a board kit and a de-embedding software tool.


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First ever IEEE P370 Plug Fest Draws a Crowd

The IEEE P370 standards group was formed over four years ago to draft a standard for the Electrical Characterization of PCB interconnects up to 50 GHz. On Monday, Jan 30, 2018, more than 30 engineers attended the organization’s first “plug fest” at the Santa Clara Convention Center to exercise some of the features of the proposed standard.


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