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Janine Love is the editor of Signal Integrity Journal, working closely with the editorial staff and Advisory Board to bring technical, high-value content to readers in digital, video, and print formats. In addition, she serves as the technical program director for EDI CON and a contributing editor to Microwave Journal.
Two full days of technical programming, the EDI CON University, panels, exhibition, networking and show floor presentations covering RF, microwave, signal integrity, power integrity and EMC/EMI await this year’s attendees in sunny Santa Clara, California.
Eric Bogatin will lead this special session again at EDI CON USA, taking on the topic of how to deliver more than 100A with less than 10 mV of noise to digital devices. See how you can get involved.
This March 20-22, EDI CON CHINA will take place at the China National Convention Center in Beijing, China. This year’s event brings its unique, high-quality technical conference with learning and training opportunities back to Beijing.
If you’re looking for a handbook on SI characterization techniques, or more specifically, TDR and VNA measurements, check out the second edition of this popular book.
An interview with Patrick Carrier of Mentor Graphics about what’s next for high-speed DDRx and SERDES designs, with a special focus on power integrity.
Last week, DesignCon 2017 put on a show for high-speed engineers that included a conference as well as an exhibition. The conference included many opportunities for speaking, and more will be happening later this year at the EDI CON USA event in Boston, September 11-13.
This year marks the first that we are running two EDI CON conferences: EDI CON China on April 19-21 in Beijing and the new EDI CON USA on September 20-22 in Boston, MA. Both conferences include an exhibition, keynotes, technical conference sessions, workshops, networking, and training opportunities.
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