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See what market experts predict for various markets related to SI, PI and EMI applications.

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Waveform Generation Using a Broadband Balun, Z-Matched Pick-Off Tee and Resistive Power Divider

This application note demonstrates use of HYPERLABS’ broadband coaxial components as general-purpose analog signal processing components for the generation of novel time-domain waveforms. The HL9474 6 dB resistive power divider and HL9462 Z-matched pick-off tee are demonstrated as lossy broadband summing networks. The HL9404 broadband balun is demonstrated as a pulse inverter and 180° signal splitter. The HL5567 PAM4 encoder is used to combine two pseudorandom binary or bit sequence (PRBS) patterns into PAM4 signaling. Utilizing the basic arithmetic functions of addition, inversion and subtraction, together with a time delay, a wide variety of novel broadband waveforms are generated. 

This application note builds on prior work reported in Picosecond Pulse Labs (PSPL) Application Note AN-20a[1]. In the referenced note, Jim Andrews, Ph.D. used PSPL pulse generators together with PSPL passive components to produce a variety of novel waveforms. A similar set of waveforms are demonstrated at higher bandwidths in this application note utilizing HYPERLABS’ industry leading broadband passive components.  


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Silicon Photonics: Vital Technology for Next-Gen Data Centers and Beyond

In lieu of the given applications and industry efforts, many enterprises and industries are now viewing silicon photonics as an inevitable component for computers and monitoring devices. As the technology is touted to mature in the coming years, chances are that supercomputers would likely reach the exascale speed around human brain’s processing power at the neural level.


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The Evolutionary Path to the 100 Amp Micromodule Regulator_thumb

The Evolutionary Path to the 100 Amp Micromodule Regulator

A micromodule device resembles a surface mount IC; however, they include all the necessary support components that would normally be used to construct a power conversion circuit. This includes a DC/DC controller, MOSFET dice, magnetics, capacitors and resistors and so on, all mounted on a thermally efficient laminate substrate. They are then encapsulated using a plastic mold cap. The result was a complete power supply that can be simply adhered to a printed circuit board. Read about the evolution of this device.


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