Market Perspectives Guest Blog

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Why Use DRAM Interposers for Signal Measurement?

The rise of AI and data centers is placing higher performance demands on systems than ever before, which requires increasingly advanced chiplet designs. The need to meet this level of performance has driven the development of new compliance standards for communication between chiplets with advanced packages.

In a recent roundtable with top embedded and micro suppliers, Shawn Luke of DigiKey spoke with experts from Analog Devices, STMicroelectronics, NXP, and Microchip Technology to hear their perspectives on the evolving landscape of embedded security and its critical role in today’s connected world. Dive into industry insights on securing embedded systems, navigating new global regulations, advanced concepts, and more.

The advancements in wireless networks are placing new demands on switches and other devices that supply power. In order to better understand these demands, Alan Jay Zwiren of Microchip Technology examines the current trends in the marketplace.

How do we really know what’s going on with celestial objects above? The SKA Observatory provides answers.

Space-based systems will play a greater role in our lives than ever before. Samtec explores the role of technology in a new age of space exploration. 

With ongoing advancements in technology, regional adoption trends, and a focus on green computing, the data center immersion cooling market is set to become a cornerstone of the next-generation digital infrastructure. 

Artificial intelligence-generated content is rewriting the rules for data center networks, driving a need for extreme throughput and density at unprecedented scales. To meet these requirements, hyperscalers need high-performance 800G network solutions as quickly as vendors can deliver them.

In this article, Yuriy Shlepnev provides an overview of Simbeor electromagnetic signal integrity software and highlights its new features.

As AI and ML technologies continue to evolve and become more prevalent in various industries, the demand for faster and more efficient data transfer methods will undoubtedly grow. In this guest blog, VIAVI reviews how PCIe 6.0 and CXL 3.x, with their advanced capabilities and perfect alignment, are already paving the way for rapid innovation in AI/ML use cases.