Pat parlayed his engineering background into a management role in marketing communications for several leading semiconductor vendors. Currently, he is a contributing editor to Signal Integrity Journal as well as serving as Editor for Microwave Journal, where he sets MWJ’s editorial direction and develops market opportunities.
DesignCon 2018 featured a 14-track conference covering the latest developments in hardware and high-speed communications design with over 100 technical sessions, three full day boot-camps, and more. Read this full review of the new products introduced at the event.
DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.
As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2017. Thank you for your readership in 2017, and we look forward to bringing you many more great technical features in 2018!
The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.
This is the first year that NIWeek has taken place in late May instead of its normal early August time slot and switches permanently to this part of the calendar. NIWeek 2017 kicked off with new CEO Alex Davern paying tribute to Dr. T with a standing ovation from the audience. Read this summary of what happened at NIWeek 2017.
After four years in Beijing, EDI CON China was held in Shanghai this year, from 27-27 April. Microwave Journal editors Pat Hindle, Gary Lerude and Janine Love compiled this overview of the conference and exhibition.
We paid our annual homage to the coolest event mascot, Chiphead, at DesignCon 2017. DesignCon is the annual meeting place for chip, board, and systems design engineers taking place at the end of January each year in Santa Clara, CA. There were more than 100 sessions spanning 14 tracks covering all aspects of electronic design; from chips through boards and systems.