Benoît Wittmann

Benoît Wittmann

Benoît Wittmann received his engineering degree in polymers physics from Strasbourg University in 2017 and his PhD in numerical mechanics from Mines Paristech in 2020. His thesis focused on the study of optical and tribological properties of multilayered polymeric materials. He currently works as an R&D engineer at Circuit Foil Luxembourg, a leading electroplated copper foil manufacturer. Benoît's research is centered around the copper foil electroplating process using finite element methods. Additionally, he investigates the physical properties of electroplated copper foil, with a particular focus on electrical conductivity and insertion loss.


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Finite Element Modeling of Copper Foil Loss From AFM Measurements

DesignCon 2023 Best Paper Award Winner

The roughness of copper foils has a detrimental effect on signal loss in PCBs. Therefore, reducing roughness is crucial in minimizing signal loss. Nevertheless, roughness is essential to ensure a good adherence between the prepreg and the copper foil. A compromise must be found between adherence and power integrity. This paper presents a novel approach to evaluate signal loss without assuming any specific roughness shape.    

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