Mohammed Al Hasani is an undergraduate electrical engineering student at the University of Colorado at Bouder. Mohammed has a passion in RF, Electromagnetic waves and transmission lines, and Signal Integrity (SI).
The first goal in any high-speed board stack up design is to engineer interconnects with a target impedance, and the first step in this process is to use a 2D field solver to explore design space with a virtual prototype. Just how well can a field solver predict the impedance of traces on a real board? This article aims to answer this question.