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Infineon Technologies AG introduces the EiceDRIVER™ 1EDN71x6G HS 200V single-channel gate driver ICs family. The product family is designed to enhance the performance of CoolGaN™ Schottky Gate (SG) HEMTs.

The MIPI Alliance announced a major update to its MIPI M-PHY physical layer interface for connecting the latest generation of flash memory-based storage and other high data rate applications in advanced 5G smartphones, wearables, PCs, industrial IoT, and automobiles.

Kandou announced volume production of its Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support.

NXP’s latest S32G3 Series extends the reach of the S32G family to offer broad scalability from vehicle microcontrollers to higher-performance vehicle compute applications with software and pin compatibility.

TEOCO has announced the latest update to its network planning tool, ASSET, with EMF analysis, support for 5G network slicing, external interference modeling and an additional automation API.

Hotwire Communications has become the first such company in the United States to deploy 25G PON (Passive Optical Network) equipment developed by Nokia in the field.

Molex has acquired core technology and intellectual property from Keyssa Inc., accelerating Molex’s strategy to further expand and diversify its micro connector portfolio with highly flexible, cable-free connectors for near-field, device-to-device applications.

TÜV SÜD is investing £1.65million in a 1,800m² fully automated EMC and RF testing facility. Based at TÜV SÜD’s Hampshire headquarters, the latest facility’s three semi-anechoic EMC chambers will be in addition to five existing ones – significantly increasing test capacity.

China Mobile International Limited (CMI) announced that construction of the China Mobile Guangdong-Hong Kong-Macao Greater Bay Area Hong Kong Fo Tan Data Center (Fo Tan Data Center) is now underway.

SnapEDA is launching a Chrome extension to allow electronics designers to find CAD models on every distributor website.