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Tektronix, Inc., announced the expansion of its scalable DPO70000SX Series Performance Oscilloscope to include new 13 GHz and 16 GHz models.

Electromagnetic compatibility (EMC) is a key prerequisite for the future topics connectivity, autonomous driving, shared, and electric drivetrain. With the new test facility, Mercedes-Benz takes an important step in the digitization of the automotive industry.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new gate driver integrated circuit from Power Integrations, Inc.

Coilcraft’s new Cx Family of surface-mount common mode chokes includes 16 sizes/configurations for a broad range of power line circuits. They suppress high frequency common mode noise up to 100 MHz and offer greater than 40 dB common mode attenuation, making them ideal for use in consumer electronics and industrial applications.

Elma Electronic Inc. has expanded its popular line of E-Frame test and development platforms to include a 3U CompactPCI Serial-based system designed for high-speed data processing. 

Silicon Labs has expanded its family of Si539x jitter attenuators with new device options featuring a fully integrated reference, enhancing system reliability and performance while simplifying PCB layout in high-speed networking designs.

Samtec Inc., will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.

imec, demonstrates a field-free switching operation of spin-orbit torque MRAM (SOT-MRAM) devices – eliminating the need for an external magnetic field during write operation. The concept is manufacturing-friendly and does not compromise the reliability and sub-ns writing performance of the SOT-MRAM devices.

KEMET Corporation expanded the temperature capability of T598 devices, a Tantalum Polymer Surface Mount Capacitor. These devices address the stringent requirements and new challenges presented by megatrend applications in automotive Advanced Driver Assistance Systems (ADAS), autonomous driving and in digitalization uses such as supercomputing, mobility services, connectivity and infotainment.