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The IPOSIM from Infineon Technologies AG is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.
Qualcomm AI200 and AI250 solutions deliver rack-scale performance and superior memory capacity for fast data center AI inference at industry-leading total cost of ownership.
Power GaN 2025, powered by Yole Group, provides a detailed look at the market growth, technology trends, and strategic shifts shaping the gallium nitride power device industry.
Yole Group’s new report, Glass Materials for Advanced Packaging 2025, provides the first in-depth analysis dedicated to the fast-growing glass materials market across multiple packaging platforms.
Based on MEMS switches, the modules are designed to simulate common faults in high-speed communication protocols, supporting the latest evolution of MultiGBASE-T1 testing requirements.
Designed for point of load power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems.
Keysight Technologies, Inc. announced the completion of its acquisition of the Optical Solutions Group from Synopsys, Inc. and PowerArtist from Ansys, Inc.
Indium Corporation announced its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests.
Data center operators requiring precise time synchronisation can integrate optical timing into existing fiber architectures —
enhancing performance and reducing costs —
with the new SYNCRO solution from HUBER+SUHNER.
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