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Assembled with next-generation thermoelectric material, the PCX Series provides faster ramp rates and higher reliability than standard thermoelectric coolers to significantly extend field use of molecular diagnostic devices.

AT&S announced detailed project information on the company’s planned investment in a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah.
 

Innodisk released the first Ultra Temperature DDR4 DRAM module that can operate from a chilling -40℃ to a scorching 125℃.

Astrodyne TDI introduced the latest DIN-rail mount EMI/EMC filter line, specially designed for industrial and medical applications that require a highly compact solution

Advanced Thermal Solutions, Inc., now provides fanSINKS™ heat sinks for component sizes ranging from 27 to 70 mm².

Infineon Technologies AG is continuously investing and transforming in futureproof semiconductor technologies and solutions, enabling environmentally friendly applications as well as performance and ease of design.

At this year's productronica in Munich, ODU will be on site with the company’s ODU-MAC® Black-Line modular mass interconnect solution. 

Rohde & Schwarz has developed a microwave measurement receiver to calibrate signal generators and attenuators with one single instrument. Most important features provided are tuned RF level measurements, level measurements, analog modulation and spectrum analysis.

Ansys and Electro Magnetic Applications, Inc. (EMA), added EMA3D Charge to its simulation solution portfolio, addressing critical design and safety needs for applications ranging from space exploration to everyday commutes. 

Seeed, a global PCB manufacturer based in Shenzhen, is adding SnapEDA computer-aided design (CAD) models to the Seeed and ShenZhen Open Parts Libraries (OPLs), to help electronics designers move from idea to fabrication with ease.