At this year's productronica in Munich, ODU will be on site with the company’s ODU-MAC® Black-Line modular mass interconnect solution. This system ensures a high degree of flexibility when testing PCBs and electronically assembled units.
The ODU-MAC® Black-Line serves as an interface between the test specimens and the test equipment. Besides reliable transmission, flexible assembly in accordance with the respective test requirements is also crucial. ODU has decades of experience in electrical connection technology and the production of modular connectors. The users thus benefit from a mass interconnect system whose flexibility is exclusive on the market. Signals, power, high current, high voltage, RF signals (coax), compressed air and fluid, vacuum, fiber optics and high speed data transmission can be combined in a single, customized interface.
Reliably and securely connected
The longevity of this mass interconnect system is ensured via tolerance compensation by means of floating docking frames, which also simplify the mating process. A high level of contact safety—and thus a reliable and consistent connection—is achieved thanks to a total of eight tightening points. Electromechanical locking, which can be operated at the push of a button or by remote control, is also possible. This results in comfortable and safe operation for the user. The quick-action locking system is also extremely user-friendly—if necessary, individual frames can be detached from the interface in seconds and easily replaced. On request, the ODU-MAC® Black-Line is available including cable assembly, and is thus ready for immediate use.
This system interface is used in the field of test and measurement technology across a wide range of industries. It is suitable for diverse applications, for example, in the automotive, medical, telecommunications, aerospace, military and consumer goods sectors.
Visit ODU at productronica, the trade fair for electronics development and manufacturing, in Hall A1, Booth No. 131. A team of experts will be on site from November 16 to 19 to answer your questions.