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Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements.

Molex has set an industry benchmark for test and measurement with the introduction of Molex Cardinal Multi-Port High Frequency Coaxial Assemblies.

Teledyne SP Devices’ ADQ35 offers a combination of speed, resolution, and flexibility for demanding scientific, industrial, and OEM applications.

The Wireless Broadband Alliance announced its new report, "AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems."

Keysight Technologies, Inc. launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Keysight has announced its new graphics double data rate 7 transmitter compliance solution, that accelerates validation of Joint Electron Device Engineering Council standards for graphics and AI applications. 

Building on the proven on-substrate and near-ASIC expertise of Molex, Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4 and beyond.

The Cadence^® ChipStack AI Super Agent is the world’s first agentic workflow for automating chip design and verification.

Keysight has introduced 3D Interconnect Designer, a new addition to its EDA portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.

According to a recently published report from Dell’Oro Group, the MCN market revenues advanced 15% Y/Y in 2025. For the first time, the 5G MCN market accounted for 50% share of the total MCN market.