Buyer's Guide

6

VNA Broadband Verification Boards

Signal Microwave and GigaProbes have developed a line of 40 and 70 GHz test boards. Created as a demonstration tool, they are also used for validating VNA calibration and operation. This helps ensure accurate measurements to 40 or 70 Ghz and they are compatible with all VNA manufactures.


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3

ELF110-xx Edge Launch Connectors, 1.00 mm Interface

These 1.00 mm Edge Launch Connectors are designed to optimize connector to board transitions. The 1.00 mm interface is mode free through 110 GHz. Test boards with microstrip and GCPWG are available to verify product performance. These boards are made with an FR-4 stiffener and only the top ground of the board is used for the board transition.


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2

ELF67-xx Edge Launch Connectors, 1.85 mm Interface

These 1.85 mm Edge Launch Connectors are designed to optimize connector to board transitions. The 1.85 mm interface is mode free through 70 GHz. Test boards with microstrip and GCPWG are available to verify product performance. These boards are made with an FR-4 stiffener and only the top ground of the board is used for the board transition.


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1

ELF40-xx Edge Launch Connectors, 2.92 mm Interface

These 2.92 mm Edge Launch Connectors are designed to optimize connector to board transitions. The 2.92mm interface is mode free through 40 GHz. Test boards with microstrip and GCPWG are available to verify product performance. These boards are made with an FR-4 stiffener and only the top ground of the board is used for the board transition.


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HyperLynx_Thermal

HyperLynx Thermal

HyperLynx® Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.


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HyperLynx_Fast_3D

HyperLynx Fast 3D Solver

HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.


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