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Microchip Technology Inc., announced the expansion of its silicon carbide portfolio with a family of high-efficiency, high-reliability 1700V silicon carbide MOSFET die, discrete and power modules.

Avishtech announced significant enhancements to its Gauss Stack PCB stack-up design and simulation toolset that enable the most accurate prediction and specification possible of the maximum fiber-weave related skew on differential pairs.

DesignCon, the premier event in high-speed communications and system design, announced a fresh raft of speakers confirmed for the 2021 edition of DesignCon, set for August 16-18 at the San Jose McEnery Convention Center. This year's conference offers the DesignCon community access to expert-led sessions, panels, tutorials, and accredited education – both free and paid – exploring emerging trends across the global $1 trillion unit semiconductor market.

More than 100 leading industry suppliers for PCB design, fabrication and assembly are expected to exhibit at PCB West this fall, UP Media Group Inc. noted. The annual trade show will feature a who’s who of leading ECAD developers, printed circuit fabricators and assemblers, and other suppliers.

Teledyne LeCroy furthers its leadership in DisplayPort testing with QualiPHY DisplayPort 2.0 source and sink compliance and DisplayPort AUX DME (Decode, Measure & Eye Diagram) oscilloscope software options, building on their recently announced industry-leading DisplayPort 2.0 Link Layer compliance test solution.

A team of engineers from the National Institute of Information and Communication Technology (NICT) in Japan has blown the old Internet speed world record of 178 terabits per second (Tb/s) out of the water. An eye-watering 319 terabits per second.

Pixus Technologies has announced a 3-slot 3U OpenVPX backplane with an additional VITA 62 PSU slot. The OpenVPX 3U backplane has a BKP3-CEN03-15.2.9 VITA 65 profile. The 3+1 slot backplane is standardly designed to PCIe Gen3 speeds with options for higher levels.  Pixus offers versions with mechanical mounting options for ATR enclosures and IEEE rackmount chassis platforms. 

Xilinx, Inc., introduced the Versal™ HBM adaptive compute acceleration platform (ACAP), the latest series in the Versal™ portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform.

Orolia has introduced EdgeSync, a cost-effective network timing platform that provides network time protocol (NTP) and precision time protocol (PTP) grandmaster and boundary clock functionality for real-time edge applications. 

Thanks to many years of experience in testing probe cards, Seica has designed the PilotV8XL HR Next> series, which is the only flying probe that can offer a full turnkey solution for the Probe Card test.