Industry News

te connectivity

TE Connectivity and Credo pave the way for 112G single lane connectivity

Live demonstration for the first time at DesignCon 2018

TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies.

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Tektronix Accelerates EMI/EMC Compliance Testing

New All-in-One Solution Saves Engineers Time and Money Spent on Failed Compliance Tests

Tektronix, Inc., a worldwide provider of measurement solutions, today introduced EMCVu, a new all-in-one solution for EMI/EMC pre-compliance testing and troubleshooting. In today’s electronic design environment, about 50 percent of products fail electromagnetic compatibility (EMC) testing the first time.

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Orbel Launches New Online Store

When it comes to EMI/RF Shielding, Orbel Corporation recognizes that engineers need the ability to access solutions in a timely manner. With that in mind, Orbel has launched a new, easy to use, online store with a unique selection of high quality products. Orbel’s store offers a wide range of EMI shielding products and custom board shield design capabilities, shipped directly from Orbel’s facility in the USA.

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Carlisle Interconnect Technologies Unveils CoreHC™ and Card Edge Connectors at DesignCon 2018

Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), is exhibiting at the upcoming DesignCon 2018 Expo in Santa Clara, CA, Jan. 31–Feb. 1, 2018 in booth #648. CarlisleIT is introducing an updated CoreHC™ interconnect solution and brand-new Card Edge Connectors contact system as part of its integrated line of high-performance microwave cables and precision RF and high-speed digital connectors for Test & Measurement applications.

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SiSoft to Present on IBIS-AMI and DDR5 at DesignCon 2018

Signal Integrity Software Inc. announced that it will present two complementary sessions focused on building IBIS-AMI models and how DDR5 AMI models can be applied to systems design.  The sessions, titled “Building AMI Models for DDR5 Applications” and “Applying IBIS-AMI Techniques to DDR5 Analysis”, will be presented on Wednesday, January 31 and Thursday, February 1 at DesignCon 2018.

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